Coskun Lab Collaborates with Brown University Researchers on Breakthrough in Chip Thermal Simulation in *NEWS, Ayse Coskun, ECE - Mobile/Cloud Computing and Cybersecurity, ECE Faculty, ECE Research, Electrical and Computer Engineering . Tagged: Ayse Coskun, Best Paper Award, Center for Information Systems and Engineering, chip cooling, chip integration, chip thermal simulation, CISE, DAC, Design Automation Conference, Donald O. Pederson Best Paper Award, electronic design automation, IEEE TCAD, semiconductors
Coskun Lab Collaborates with Brown University Researchers on Breakthrough in Chip Thermal Simulation in *NEWS, Ayse Coskun, ECE - Mobile/Cloud Computing and Cybersecurity, ECE Faculty, ECE Research, Electrical and Computer Engineering . Tagged: Ayse Coskun, Best Paper Award, Center for Information Systems and Engineering, chip cooling, chip integration, chip thermal simulation, CISE, DAC, Design Automation Conference, Donald O. Pederson Best Paper Award, electronic design automation, IEEE TCAD, semiconductors