Physical processes and manufacturing strategies for the fabrication and manufacture of microelectronic devices. Processing and device aspects instrumental in silicon, including the fabrication of doping distributions, etching, photolithography, interconnect construction, and packaging. Future directions and connections to novel devices, MEMS, photonics, and nanoscale structures will be discussed. Emphasis will be on “designing for manufacturability.” The overall integration with methods and tools employed by device and circuit designers will be covered. Same as ENGME579. Students may not receive credit for both.