PhD Final Dissertation Defense: Tenzile Berkin Cilingiroglu
- 12:00 pm on Friday, August 15, 2014
- 1:30 pm on Friday, August 15, 2014
- 8 Saint Mary's Street, Room 339
The increasing density and smaller length scales in integrated circuits (ICs) create resolution challenges for optical failure analysis techniques. Due to flip-chip bonding and dense metal layers on the front side, optical analysis of ICs is restricted to backside imaging through the silicon substrate, which limits the spatial resolution due to the minimum wavelength of transmission and refraction at the planar interface. The state-of-the art backside analysis approach is to use aplanatic solid immersion lenses in order to achieve the highest possible numerical aperture of the imaging system. Signal processing algorithms are essential to complement the optical microscopy efforts to increase resolution through hardware modifications in order to meet the resolution requirements of new IC technologies.