Optoelectronic Processing Facility

The Optoelectronic Processing Facility is a multi-user cleanroom outfitted with state-of-the-art equipment for fabricating semiconductor and optoelectronic devices on a wafer to die level. The facility includes both a Class 100 photolithography room and a Class 1000 Cleanroom. In the Class 1000 cleanroom, capabilities include wet chemical processing, thin film deposition (including thermal oxidation and annealing), plasma etching and cleaning, and electrical testing after wirebonding.

Address: 8 Saint Mary's St., Room 816, Boston, MA 02215, Tel: (617) 358-2017
Lab Manager: Mr. Paul Mak, pmak@bu.edu

Class 100 Photolithography Cleanroom
Instrument Make Model
Photoresist Spinner Hood Headway Research CB-15
Spinner/Hotplate System Karl Suss Delta 80T2
Mask Aligner Karl Suss MJB3
Mask Aligner Karl Suss MA6
Microscope Nikon Optiphot 150S

Thin Film Deposition and Analysis Equipment
Instrument Make Model
Thermal Evaporator BOC Edwards Auto 306
Electron Beam Evaporator BOC Edwards Auto 306
Ion Beam Assisted Deposition Commonwealth Scientific 1160
Thermal Oxide Furnace MRL Industries HT 1012
DC/RF Magnetron Sputter Denton Vacuum Discovery 18
Electron Beam Evaporator Sharon Vacuum Custom Designed
Rapid Thermal Processor Modular Process Technology 600S
Ellipsometer Rudolph Auto EL-II

Plasma Etching and Cleaning
Instrument Make Model
Reactive Ion Etcher Plasma-Therm 790
Plasma Asher PVA TePla America M4L
Deep Reactive Ion Etcher Surface Technology Systems ASE HRM
Chemical Hood N/A N/A
Surface Profilier KLA Tencor Alpha-Step 500

Wirebonding and Electrical Testing
Instrument Make Model
Ball Bonder Kulicke & Soffa 4124
Wedge Bonder Kulicke & Soffa 4523
Probe Station Karl Suss PM5
Semiconductor Parameter Analyzer HP 4155A
Precision LCR Meter HP 4284A
4 Point Probe Cascade Microtech CPS-05

Post Processing Equipment
Instrument Make Model
Manual Scriber Karl Suss HR100
Stereo Microscope Nikon SMZ-800
Microscope Leitz Metalloplan
Dicing Saw Dicing Technology Basic-Dice II