OSP FO# 11-085
AGENCY: Department of Defense (DOD)/Defense Advanced Research Projects Agency (DARPA)/Microsystems Technology Office (MTO)
OBJECTIVES: This program is seeking innovative proposals in the area of Electronic-Photonic Heterogeneous Integration (E-PHI), an element of the DARPA Diverse Accessible Heterogeneous Integration (DAHI) program. The DAHI program seeks to develop a manufacturable technology for device-level heterogeneous integration of a wide array of materials and devices (including electronics, photonics, and MEMS technologies) with complex silicon-enabled architectures on a common Si substrate platform. The goal of E-PHI is to develop the necessary technologies, architectures, and design innovations to enable novel chip-scale electronic-photonic/mixed-signal integrated circuits on a common silicon substrate. This technology is expected to enable a wide range of novel chip-scale optoelectronic microsystems, including transceivers for telecommunications, coherent optical systems for sensing (LADAR) and communications, optical arbitrary waveform generators, and multi-wavelength imagers with integrated image processing and readout circuitry.
The E-PHI program will seek to demonstrate novel high-performance heterogeneous electronic-photonic integrated microsystems which offer a considerable performance improvement and size reduction versus current, state-of-the-art technologies. Of particular interest are low noise, electronic-photonic signal sources in the radio-frequency (20 GHz) and near infrared (1000-2000 nm) optical frequency regimes. It is anticipated that such chip-scale, heterogeneously integrated, low-noise signal sources will provide unprecedented capabilities for optical gyroscopes, direction finding, optical communications, and frequency references/system synchronization for advanced high-bandwidth RF and mixed signal chip-integrated systems, among other applications. Ultimately, it is expected that the heterogeneous integration technologies developed within E-PHI will be transferrable to a standardized foundry environment and utilize existing Si CMOS fabrication infrastructure.
The goal of this program is to develop novel electronic-photonic integrated circuit technologies which can be integrated with Si CMOS electronics and other microsystems components on a common silicon-based substrate platform. The challenges associated with this goal will be addressed in three technical areas: (1) Heterogeneous Electronic-Photonic Integration Process and Device Technologies, (2) Heterogeneously Integrated Electronic-Photonic Architectures, and (3) Demonstration Microsystems. Proposals to individual technical areas within this BAA will be considered; however, proposals that comprehensively address all technical areas are of particular interest.
Proposers are encouraged to specify intermediate goals/metrics and establish a schedule of deliverables consistent with the final program objectives. Please see program announcement for further program details.
DEADLINE: June 3, 2011 12:00PM Eastern
FUNDING INFORMATION: Multiple awards are anticipated. The amount of resources made available under this program will depend on the quality of the proposals received and the availability of funds.
Dr. Scott Rodgers
3701 North Fairfax Drive
Arlington, Virginia 22203-1714
REMARKS: Full proposals may be submitted through the T-FIMS application or through the Grants.gov system. Grant or cooperative agreement proposals may only be submitted to DARPA through Grants.gov or in hard-copy. Applications cannot be submitted in part to Grants.gov and in part as a hard-copy. Instructions and forms are available on the Grants.Gov web site (http://www.grants.gov). Additional information about Grants.gov for BU Investigators can be obtained on the OSP web site at: http://www.bu.edu/osp/proposal-preparation/electronic-submission/. Investigators should contact the OSP Assistant Director assigned to their school or department as soon as possible to coordinate submission through the Grants.gov system.
Complete program guidelines and application material (DARPA-BAA-11-45) may be obtained from the web sites listed above or from the Office of Sponsored Programs (OSP). Please distribute this notice to any faculty or staff members who might be interested in the information. For more information, please contact the OSP at X3-4365 or firstname.lastname@example.org, or visit the OSP web site at http://www.bu.edu/osp.