Ronald Knepper

Ronald KnepperProfessor
PhD, Carnegie Mellon University, 1969


(617) 353-0223
webpage
office: PHO 526
office hours: Monday, Tuesday, Wednesday, Thursday, 2:00-4:00 PM

Honors, Awards, and Editorships

  • Life Fellow, IEEE
  • 1989 IBM Outstanding Innovation Award
  • 1988 IBM Division Award
  • 1983 IBM Outstanding Technical Achievement Award
  • Past Editor, Solid State Electronic

Classes Taught

  • EC 700 Adv Special Topics
  • EC 582 RF/Analog IC Design Fundamentals
  • EC 580 Modern Active Circuit Design
  • EC 571 VLSI Principles and Applications
  • EC 500 Special Topics in ECE
  • EC 466
  • EC 464 Senior Design Project II
  • EC 412 Analog Electronics
  • EC 410 Introduction to Electronics
  • EC 312 Computer Organization

Research Interests

  • VLSI integrated circuit technology
  • SiGe BICMOS device and circuit modeling
  • silicon CMOS and bipolar devices
  • numerical device simulation
  • RF/analog IC design

Selected Publications

  • “Modeling and Experimental Measurement of Active Substrate Noise Suppression in Mixed Signal 0.18um BiCMOS Technology,” H Dai and RW Knepper, accepted for publication in IEEE Trans on Computer-Aided Design of Integrated Circuits and Systems, 2009.
  • “Differential Sensing of Substrate Noise in Mixed-Signal 0.18um BiCMOS Technology,” H Dai and RW Knepper, IEEE Electron Device Letters, Vol. 29, No. 8, pp. 898-901, August 2008.
  • “A Low Noise, Broadband Cryogenic preamplifier operated in a High Field Superconducting Magnet,” R. Mathur, RW Knepper, and PB O’Connor, IEEE Transactions on Applied Superconductivity, Vol. 18, No. 4, pp. 1781-1789, Sept. 2008.
  • “A Novel, High Sensitivity Cryogenic Fourier Transform Ion Cyclotron Mass Spectrometer,” R Mathur, C Lin, K Aizikov, RW Knepper, PB O’Connor, 56th ASMS Conference on Mass Spectrometry, Denver, CO, June 2-6, 2008.
  • “Chip Substrate Resistance Modeling Technique for Integrated Circuit Design,” IEEE Int’l Symposium on Circuits and Systems, vol. 2, pp. 762-765, May 1983; and IEEE Trans Computer-Aided Design, Vol. CAD-3, No. 2, pp. 126-134, April 1984; Johnson, Knepper, Marcello, and Wang.