Yeni Sayfa 1
 
 
 
 
 


 

acoskun(at)bu.edu
 

 
 

Phone:
(617) 358-3641 (Office)


 

 

Fax:
(617) 353-7337

 
 

Address:
Boston University
ECE Department
8 St. Mary's Street
Boston, MA 02215
 

 
 

Office:
PHO 336

 


 

 

 

 

 
  Accordion

My research group's new website is now online: PeacLab

Current Projects

Modeling and management of 3D stacked architectures

3D stacking is an attractive method for designing high-performance chips as it provides high transistor integration densities, improves manufacturing yield due to smaller chip area, reduces wirelength and capacitance, and enables heterogeneous integration of different technologies on the same chip. Stacking, however, increases the thermal resistivity and the on-chip temperatures.

This project focuses on several key aspects that will enable cost-efficient design of future high-performance 3D stacks: (1) Thermal modeling and management of 3D systems; (2) Active cooling (e.g., water cooling) modeling and control to improve cooling efficiency; (3) Architecture-level performance evaluation and optimization of various 3D design strategies to understand performance impact on real-life applications.


Software optimization for green computing

This project targets developing inexpensive, widely applicable methods for generating Green Software for reducing the total cost of computing while achieving high performance and reliability. Specific aims are:

(1) Designing mechanisms for creating software variations that are plausibly optimal with respect to performance, energy, and temperature. Some of these are based on existing methods of optimizing for performance such as code transformations and autotuning. Case studies include production applications from document/media processing, scientific computing, and bioinformatics.

(2) Designing consolidation methods to manage resource sharing of software on computing clusters for enabling energy proportional computing. The methods include explicit consideration of the temperature effects and cooling as well as the equipment and energy costs.

Energy and thermal management of manycore systems

Single-chip multicore systems have become increasingly attractive in the recent years because of their potential to provide higher throughput per watt in comparison to single-core systems. It has not been possible, however, to achieve the projected ideal peak performance due to high power densities, prohibitive cooling costs, thermal gradients, suboptimal resource utilization due to dynamically varying workloads, and limited memory bandwidth.

The main objective of this project is to develop a suite of run-time management techniques for manycore systems by jointly exploring key contributors to system performance and power: reconfigurable network architectures, workload scheduling policies, and microarchitectural resource management. We utilize an integrated hardware-software approach to dynamically monitor system behavior and to enforce intelligent decisions for improving performance, energy efficiency and thermal behavior. In addition to simulation and emulation tools, we run experiments on Intel's 48-core Single-Chip Cloud and other commercial servers as part of our research.

People

Jie Meng

PhD Student

Research topic: Performance and energy management of high-performance manycore systems and 3D stacked architectures. 
 

Can Hankendi

PhD Student

Research topic: Software optimization for green computing, energy-efficient consolidation and scheduling for parallel workloads. 
  

Tiansheng Zhang

PhD Student

Research topic: Leakage-aware thermal control of servers, runtime management of manycore (2D and 3D) systems. 
  

Fulya Kaplan

PhD Student

Research topic: Reliability analysis and optimization for parallel systems. 
  

John-Nicholas Furst

Undergraduate Student

Research topic: Analysis and dynamic management of manycore systems, focusing on Intel Single-Chip Cloud.  
  

Katsutoshi Kawakami

Undergraduate Student

Research topic: Developing thermal simulation software for 3D stacked system, including liquid-cooled systems.  
  

Previous Members

Daniel Rossell

MS (LEAP) Student

Research topic: Modeling and implementation of thermal simulators for 3D stacked systems with liquid cooling. 
  

Ryan Mullen

B.S., Spring 2010.

Research topic: Power and performance modeling and measurement for multicore architectures.
First position after graduation: Embedded systems engineer, BNS Solutions, MA.  
 

Funding

NSF CAREER, 2012-2017.
Massachusetts Green High Performance Computing Center, Holyoke, 2012-2013.
VMware, 2011-2012.
Oracle, 2011-2012.
Design Automation Conference (DAC) Richard Newton Scholarship, 2011.
Dean's Catalyst Award, College of Engineering, Boston University, 2010.
Sun Microsystems (now Oracle), 2010.

Previous Projects